The objective of this project is to develop new methods of assembling SiC components for aeronautical applications, compatible with high-temperature environments (150-300 ° C). Two demonstrators will be realized: - A power rectifier bridge integrated in a compact power module operating at high temperature - An electronic relay in high-temperature package type Silicon Nitride The assembly of SiC components will be based on new technologies: - Bonding of the chip by diffusion brazing and silver sintering processes - Wiring the chip by welding copper clips and by wire ribbon - Encapsulation using new high temperature compatible materials developed and tested in this project
Rapport final : 1
Publication scientifique : 90
Emplois crées : 18
Action de communication : 9
Nouveau projet : 9
Produit / Prototype : 36
Rapport final : 8
Début du projet le 11 / 05 / 2021 | Fin du projet le 11 / 05 / 2021
Domaines d'activité stratégiques
Matériaux et composants pour l'électronique
