SICRATES

Completed

The objective of this project is to develop new methods of assembling SiC components for aeronautical applications, compatible with high-temperature environments (150-300 ° C). Two demonstrators will be realized: - A power rectifier bridge integrated in a compact power module operating at high temperature - An electronic relay in high-temperature package type Silicon Nitride The assembly of SiC components will be based on new technologies: - Bonding of the chip by diffusion brazing and silver sintering processes - Wiring the chip by welding copper clips and by wire ribbon - Encapsulation using new high temperature compatible materials developed and tested in this project

Project benefits

Rapport final : 1

Publication scientifique : 90

Emplois crées : 18

Action de communication : 9

Nouveau projet : 9

Produit / Prototype : 36

Rapport final : 8

People involved in the project

Project leader

Member partner

No member partner

ASCATRON

LABORATOIRE IMS

THALES MICROELECTRONICS

LABORATOIRE LPPI (LABORATOIRE DE PHYSICOCHIMIE DES POLYMÈRES ET INTERFACES)

EADS IW

HISPANO SUIZA

Information of the project

Start of the project on01 / 01 / 2014 | End of project on31 / 12 / 2016


Strategic business lines

Matériaux et composants pour l'électronique


Referent of the project

Nicolas POUSSET
Directeur Technique

07 86 53 38 70

nicolas.pousset-s2e2-ext@st.com

Centre-Val de loire