SICRATES

The objective of this project is to develop new methods of assembling SiC components for aeronautical applications, compatible with high-temperature environments (150-300 ° C). Two demonstrators will be realized: - A power rectifier bridge integrated in a compact power module operating at high temperature - An electronic relay in high-temperature package type Silicon Nitride The assembly of SiC components will be based on new technologies: - Bonding of the chip by diffusion brazing and silver sintering processes - Wiring the chip by welding copper clips and by wire ribbon - Encapsulation using new high temperature compatible materials developed and tested in this project