The WInSiC4AP project (Wide band gap innovative SiC for advanced power) focuses on the development of innovative components based on SiC technology. These components will make significant progress in the areas of energy efficiency and power density. The WInSiC4AP project brings together 20 European partners, including the GREMAN laboratory. As part of this project, GREMAN will study a laser annealing method for rear-panel contacts, compatible with the integrity of the component already produced.
Suivi de projet - Pendant le projet : 1
Suivi de projet - Pendant le projet : 59
Action de communication : 120
Publication scientifique : 520
Thèse : 20
Nouveau projet : 20
Member partner
No member partner
NEXTER
STMICROELECTRONICS - CATANE
CNR (CONSIGLIO NAZIONALE DELLE RICERCHE)
UNIVERSITY OF CATANIA
UNIVERSITY OF MESSINA
UNIVERSITY OF PRAHA
UNIVERSITY OF HANNOVER
THE NATIONAL INTERUNIVERSITY CONSORTIUM FOR NANOELECTRONICS IU.NET
VALEO SYSTÈMES CONTRÔLE MOTEURS
ZODIAC AERO ELECTRIC
APOJEE
APSI3D
SICILIAN AIRBUS TRAVEL - SAT GROUP
INSTITUTE OF MICROELECTRONIC APPLICATIONS - IMA
ENEL DISTRIBUZIONE
SOFTECO
DISTRETTO TECNOLOGICO AEROSPAZIALE DELLA CAMPANIA - DAC
WURTH ELEKTRONIK EISOS GMBH & CO KG
Start of the project on08 / 10 / 2024 | End of project on08 / 10 / 2024
Strategic business lines
Électronique : matériaux, composants et sous-systèmes
Referent of the project
Alexandre CHARI
06 10 33 89 48
alexandre.chari@s2e2.fr
Bruxelles
