The objective of this project is to achieve high surface area silicon nanostructures for next generations of active and passive components with high integration density. The proposed route for the realization of nanostructures is to use masks based on inexpensive homopolymer mixtures and to transfer nanopatterns to silicon by plasma cryogravure.

Project benefits

Thèse : 1

Publication scientifique : 27

Procédé : 6

Rapport final : 3

Emplois crées : 6

Thèse : 2

People involved in the project

Project leader

Member partner

Information of the project

Start of the project on22 / 09 / 2014 | End of project on01 / 09 / 2017

Strategic business lines

Matériaux et composants pour l'électronique

Referent of the project

Chargé de projets innovants

07 86 53 38 74

Centre-Val de Loire