The objective of this project is to achieve high surface area silicon nanostructures for next generations of active and passive components with high integration density. The proposed route for the realization of nanostructures is to use masks based on inexpensive homopolymer mixtures and to transfer nanopatterns to silicon by plasma cryogravure.
Thèse : 1
Publication scientifique : 27
Procédé : 6
Rapport final : 3
Emplois crées : 6
Thèse : 2
Project leader
Member partner
Start of the project on12 / 10 / 2024 | End of project on12 / 10 / 2024
Strategic business lines
Électronique : matériaux, composants et sous-systèmes
Referent of the project
07 86 53 38 74
sebastien.desplobain@s2e2.fr
Centre-Val de Loire