The project aims to study innovative materials for the flexible packaging of electronic components. The desired properties are both a polymerization temperature below 60 ° C to prevent degradation of the electronic components during the removal of the polymer, and a so-called flexible and stretchable mechanical behavior. The packaging must seal and protect the interconnection between the electronic component and the flexible substrate.
Rapport final : 4
Emplois crées : 8
Publication scientifique : 8
Project leader
Member partner
Start of the project on28 / 05 / 2023 | End of project on28 / 05 / 2023
Strategic business lines
Bâtiments et territoires intelligents
Électronique : matériaux, composants et sous-systèmes
Referent of the project
Sébastien DESPLOBAIN
07 86 53 38 74
sebastien.desplobain-s2e2-ext@st.com
Centre-Val de Loire
