The project aims to study innovative materials for the flexible packaging of electronic components. The desired properties are both a polymerization temperature below 60 ° C to prevent degradation of the electronic components during the removal of the polymer, and a so-called flexible and stretchable mechanical behavior. The packaging must seal and protect the interconnection between the electronic component and the flexible substrate.
Rapport final : 4
Emplois crées : 8
Publication scientifique : 8
Project leader
Member partner
Start of the project on01 / 09 / 2015 | End of project on05 / 08 / 2019
Strategic business lines
Bâtiments intelligents
Matériaux et composants pour l'électronique
Referent of the project
07 86 53 38 70
nicolas.pousset-s2e2-ext@st.com
Centre-Val de loire
