The project aims to study innovative materials for the flexible packaging of electronic components. The desired properties are both a polymerization temperature below 60 ° C to prevent degradation of the electronic components during the removal of the polymer, and a so-called flexible and stretchable mechanical behavior. The packaging must seal and protect the interconnection between the electronic component and the flexible substrate.

Project benefits

Rapport final : 4

Emplois crées : 8

Publication scientifique : 8

People involved in the project

Project leader

Member partner

Information of the project

Start of the project on21 / 05 / 2024 | End of project on21 / 05 / 2024

Strategic business lines

Bâtiments et territoires intelligents

Électronique : matériaux, composants et sous-systèmes

Referent of the project

Chargé de projets innovants

07 86 53 38 74


Centre-Val de Loire