In applications such as mobile phones and payment cards, the 3D integration of electronic chips becomes more and more unavoidable for system miniaturization. The 3DICE project aims at this 3D integration of electronic dies over silicon or organic substrates even flexible or ultra-thin ones.
Publication scientifique : 330
Emplois crées : 110
Rapport final : 11
Brevet : 99
Thèse : 22
Project leader
Member partner
No member partner
3DPLUS
CEA - LETI
DATACON
PVA TEPLA
REPLISAURUS
SPTS FRANCE (ADIXEN)
LABORATOIRE EMSE
DISCO
EVG
Start of the project on01 / 09 / 2009 | End of project on01 / 04 / 2013
Strategic business lines
Matériaux et composants pour l'électronique
Referent of the project
07 86 53 38 70
nicolas.pousset-s2e2-ext@st.com
Centre-Val de loire
