3DCAP

Completed

The capacitance miniaturisation integrated over electronic dies yields to adopt 3D structures and to seek materials with high dielectric constant. The 3DCAP project develops a breakthrough process for surface coating of mixed-oxydes (perovskites, titanates,...) particularly well adapted for 3D-structure design. The project will eventually obtain capacitances up to 1000nF/mm2, which is 10 to 20 times more than integrated capacitors available from the latest R&D developments.

Project benefits

Publication scientifique : 57

Emplois crées : 3

Rapport final : 3

People involved in the project

Project leader

Member partner

Information of the project

Start of the project on01 / 02 / 2010 | End of project on31 / 07 / 2013


Strategic business lines

Matériaux et composants pour l'électronique


Referent of the project

Nicolas POUSSET
Responsable Technique

07 86 53 38 70

nicolas.pousset-s2e2-ext@st.com

Centre val de loire