The project aims to study innovative materials for the flexible packaging of electronic components. The desired properties are both a polymerization temperature below 60 ° C to prevent degradation of the electronic components during the removal of the polymer, and a so-called flexible and stretchable mechanical behavior. The packaging must seal and protect the interconnection between the electronic component and the flexible substrate.
Suivi de projet - Fin du projet : 4
Emplois crées : 8
Publication scientifique : 8
Début du projet le 11 / 05 / 2021 | Fin du projet le 11 / 05 / 2021
Domaines d'activité stratégiques
Bâtiments intelligents
