3DICE

Completed

In applications such as mobile phones and payment cards, the 3D integration of electronic chips becomes more and more unavoidable for system miniaturization. The 3DICE project aims at this 3D integration of electronic dies over silicon or organic substrates even flexible or ultra-thin ones.

Project benefits

Publication scientifique : 330

Brevet : 99

Emplois crées : 110

Rapport final : 11

Thèse : 22

People involved in the project

Project leader

Member partner

No member partner

3DPLUS

CEA - LETI

DATACON

PVA TEPLA

REPLISAURUS

SPTS France (ADIXEN)

Laboratoire EMSE

DISCO

EVG

Information of the project

Start of the project on01 / 09 / 2009 | End of project on01 / 04 / 2013


Strategic business lines

Matériaux et composants pour l'électronique


Referent of the project

Nicolas POUSSET
Directeur Technique

07 86 53 38 70

nicolas.pousset-s2e2-ext@st.com

Centre val de loire